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 BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
Rev. 02 -- 4 March 2010 Product data sheet
1. Product profile
1.1 General description
The BGU7005 is a Low Noise Amplifier (LNA) for GPS receiver applications in a plastic leadless 6-pin, extremely small SOT886 package. The BGU7005 requires only one external matching inductor and one external decoupling capacitor. The BGU7005 adapts itself to the changing environment resulting from co-habitation of different radio systems in modern cellular handsets. It has been designed for low power consumption and optimal performance when jamming signals from co-existing cellular transmitters are present. At low jamming power levels it delivers 16.5 dB gain at a noise figure of 0.9 dB. During high jamming power levels, resulting for example from a cellular transmit burst, it temporarily increases its bias current to improve sensitivity.
CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling.
1.2 Features and benefits
Small 6-pin leadless package 1 mm x 1.45 mm x 0.5 mm Low noise high gain MMIC Integrated temperature stabilized bias for easy design Requires only one input matching inductor and one supply decoupling capacitor Input and output DC decoupled Noise figure (NF) = 0.9 dB at 1.575 GHz Integrated matching for the output Gain 16.5 dB at 1.575 GHz High 1 dB compression point of -11 dBm High out of band IP3i of 9 dBm 110 GHz transit frequency - SiGe:C technology Supply voltage 1.5 V to 2.85 V, optimized for 1.8 V Power-down mode current consumption < 1 A Optimized performance at low 4.5 mA supply current ESD protection on all pins (HBM > 1 kV)
1.3 Applications
LNA for GPS in handsets, PDA's and Portable Navigation Devices
NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
1.4 Quick reference data
Table 1. Quick reference data f = 1575 MHz; VCC = 1.8 V; Pi < -40 dBm; Tamb = 25 C; input matched to 50 using a 5.6 nH inductor; unless otherwise specified. Symbol Parameter VCC ICC supply voltage supply current Conditions RF input AC coupled VENABLE 0.8 V Pi < -40 dBm Pi = -20 dBm Gp NF Pi(1dB) power gain noise figure input power at 1 dB gain compression Pi < -40 dBm Pi = -20 dBm Pi < -40 dBm Pi = -20 dBm f = 1.575 GHz VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V IP3i input third-order intercept point f = 1.575 GHz VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V
[1] f1 = 1713 MHz; f2 = 1851 MHz.
[1] [1] [1]
Min Typ Max Unit 1.5 14 15 4.5 12 2.85 V mA mA dB dB dB dB dBm dBm dBm dBm dBm dBm
16.5 19 17.5 20 0.9 1.2 1.3 1.6 -
-15 -12 -14 -11 -11 -8 5 5 5 8 9 12
2. Pinning information
Table 2. Pin 1 2 3 4 5 6 Pinning Description GND GND RF_IN VCC ENABLE RF_OUT
6 5 bottom view 4 2 1
sym129
Simplified outline
1 2 3
Graphic symbol
4 5
3
6
3. Ordering information
Table 3. Ordering information Package Name BGU7005 XSON6 Description Version plastic extremely thin small outline package; no leads; SOT886 6 terminals; body 1 x 1.45 x 0.5 mm Type number
BGU7005_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 4 March 2010
2 of 19
NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
4. Marking
Table 4. BGU7005 Marking codes Marking code AC Type number
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC Ptot Tstg Tj
[1]
Parameter supply voltage total power dissipation storage temperature junction temperature
Conditions RF input AC coupled Tsp 130 C
[1]
Min -0.2 -65 -
Max +3.1 55 150 150
Unit V mW C C
Tsp is the temperature at the soldering point of the emitter lead.
6. Thermal characteristics
Table 6. Symbol Rth(j-sp) Thermal characteristics Parameter thermal resistance from junction to solder point Conditions Typ 225 Unit K/W
7. Characteristics
Table 7. Characteristics f = 1575 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; Pi < -40 dBm; Tamb = 25 C; input matched to 50 using a 5.6 nH inductor; unless otherwise specified. Symbol Parameter VCC ICC supply voltage supply current Conditions RF input AC coupled VENABLE 0.8 V Pi < -40 dBm Pi = -20 dBm VENABLE 0.35 V Tamb ambient temperature 4.5 12 +85 mA mA C Min Typ 1.5 Max 2.85 Unit V
0.001 mA
-40 +25
BGU7005_2
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Product data sheet
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NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
Table 7. Characteristics ...continued f = 1575 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; Pi < -40 dBm; Tamb = 25 C; input matched to 50 using a 5.6 nH inductor; unless otherwise specified. Symbol Parameter Gp power gain Conditions Tamb = 25 C no jammer Pi = -20 dBm; fi = 1575 MHz Pjam = -20 dBm; fjam = 850 MHz Pjam = -20 dBm; fjam = 1850 MHz -40 C Tamb +85 C no jammer Pi = -20 dBm; fi = 1575 MHz Pjam = -20 dBm; fjam = 850 MHz Pjam = -20 dBm; fjam = 1850 MHz RLin RLout ISL NF input return loss output return loss isolation noise figure Tamb = 25 C no jammer Pi = -20 dBm; fi = 1575 MHz Pjam = -20 dBm; fjam = 850 MHz Pjam = -20 dBm; fjam = 1850 MHz -40 C Tamb +85 C no jammer Pi = -20 dBm; fi = 1575 MHz Pjam = -20 dBm; fjam = 850 MHz Pjam = -20 dBm; fjam = 1850 MHz Pi(1dB) input power at 1 dB gain compression f = 1575 MHz VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V f = 806 MHz to 928 MHz VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V f = 1612 MHz to 1909 MHz VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V
[1] [1] [1] [1] [1] [1]
Min Typ 14 15 15 15 13 14 14 14 5 6 10 10 20 -
Max
Unit dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dBm dBm dBm dBm dBm dBm dBm dBm dBm
16.5 19 17.5 20 17.5 20 17.5 20 8 10 20 14 23 0.9 1.2 1.1 1.3 20 21 21 21 1.3 1.6 1.5 1.7 1.7 1.9 1.8 2.0 -
Pi < -40 dBm Pi = -20 dBm Pi < -40 dBm Pi = -20 dBm
-15 -12 -14 -11 -11 -8 -15 -12 -14 -11 -14 -11 -13 -10 -12 -9 -10 -7
BGU7005_2
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 4 March 2010
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NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
Table 7. Characteristics ...continued f = 1575 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; Pi < -40 dBm; Tamb = 25 C; input matched to 50 using a 5.6 nH inductor; unless otherwise specified. Symbol Parameter IP3i input third-order intercept point Conditions f = 1.575 GHz VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V ton toff K
[1] [2] [3]
[2] [2] [2] [3] [3]
Min Typ 5 5 5 1 8 9 12 -
Max 2 1 -
Unit dBm dBm dBm s s
turn-on time turn-off time Rollett stability factor
Out of band. f1 = 1713 MHz; f2 = 1851 MHz. Within 10 % of the final gain.
Table 8.
-40 C Tamb +85 C; 1.5 V VCC 2.85 V
VENABLE (V) 0.35 0.8 State OFF ON
ENABLE (pin 5)
8. Application information
8.1 GPS LNA
Ven Vcc
C1
RFin
5
L1
3
IC1
4 1
6
RFout
2
001aak685
For a list of components see Table 9.
Fig 1.
Schematics GPS LNA evaluation board
Table 9. List of components For schematics see Figure 1. Component C1 IC1 L1 Description decoupling capacitor BGU7005 high quality matching inductor Value 1 nF 5.6 nH Supplier various NXP Murata LQW15A Remarks
BGU7005_2
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 4 March 2010
5 of 19
NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
6 ICC (mA) 5
001aak688
6 ICC (mA) 5
001aak689
(1)
(2) (3)
(3) (2) (1)
4
4
3 1.0
1.5
2.0
2.5
3.0 3.5 VCC (V)
3 -55
-15
25
65
105 Tamb (C)
Pi = -45 dBm. (1) Tamb = -40 C (2) Tamb = +25 C (3) Tamb = +85 C
Pi = -45 dBm. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V
Fig 2.
Supply current as a function of supply voltage; typical values
Fig 3.
Supply current as a function of ambient temperature; typical values
20 Gp (dB) 16
001aak690
20 Gp (dB) 16
001aak691
12
(1) (2)
12
(4) (3)
8
(3)
8
(2) (1)
4
4
0 500
1000
1500
2000
2500 3000 f (MHz)
0 500
1000
1500
2000
2500 3000 f (MHz)
VCC = 1.8 V; Pi = -45 dBm. (1) Tamb = -40 C (2) Tamb = +25 C (3) Tamb = +85 C
VCC = 1.8 V; Tamb = 25 C. (1) Pi = -45 dBm (2) Pi = -30 dBm (3) Pi = -20 dBm (4) Pi = -15 dBm
Fig 4.
Power gain as a function of frequency; typical values
Fig 5.
Power gain as a function of frequency; typical values
BGU7005_2
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 4 March 2010
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NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
18 Gp (dB)
(3)
001aak692
20 Gp (dB) 17 Gp
(3) (2) (1) (3) (2) (1)
001aak693
20 ICC (mA) 15
12
(2) (1)
14 ICC 6 11
10
5
0 500
1000
1500
2000
2500 3000 f (MHz)
8 -50
-40
-30
-20
-10 0 Pi (dBm)
0
Pi = -45 dBm; Tamb = 25 C. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V
Tamb = 25 C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V
Fig 6.
Power gain as a function of frequency; typical values
Fig 7.
Power gain as a function of input power; typical values
1.6 NF (dB) 1.2
001aak694
1.6 NF (dB) 1.2
001aak695
0.8
0.8
0.4
0.4
0 1.2
1.6
2.0
2.4
2.8 3.2 VCC (V)
0 -50
-20
10
40
70 100 Tamb (C)
f = 1575 MHz; Tamb = 25 C; no jammer.
f = 1575 MHz; VCC = 1.8 V; no jammer.
Fig 8.
Noise figure as a function of supply current; typical values
Fig 9.
Noise figure as a function of ambient temperature; typical values
BGU7005_2
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 4 March 2010
7 of 19
NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
4 NF (dB) 3
001aak696
4 NF (dB) 3
001aak697
2
2
(3)
(3)
1
(2) (1)
1
(2) (1)
0 -50
-40
-30
-20
-10 0 Pjam (dBm)
0 -50
-40
-30
-20
-10 0 Pjam (dBm)
fjam= 850 MHz; Tamb = 25 C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V
fjam= 1850 MHz; Tamb = 25 C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V
Fig 10. Noise figure as a function of jamming power; typical values
Fig 11. Noise figure as a function of jamming power; typical values
0 RLin (dB) -3
001aak698
0 RLin (dB) -3
(1)
001aak699
-6
-6
(2) (3) (4)
-9
-9
-12
(1) (2) (3)
-12
-15 500
1000
1500
2000
2500 3000 f (MHz)
-15 500
1000
1500
2000
2500 3000 f (MHz)
VCC = 1.8 V; Pi = -45 dBm. (1) Tamb = -40 C (2) Tamb = +25 C (3) Tamb = +85 C
VCC = 1.8 V; Tamb = 25 C. (1) Pi = -45 dBm (2) Pi = -30 dBm (3) Pi = -20 dBm (4) Pi = -15 dBm
Fig 12. Input return loss as a function of frequency; typical values
Fig 13. Input return loss as a function of frequency; typical values
BGU7005_2
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 4 March 2010
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NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
0 RLin (dB) -3
001aak700
0 RLin (dB) -3
001aak701
-6
-6
-9
(1)
-9
(1) (2) (3)
-12
(2) (3)
-12
-15 500
1000
1500
2000
2500 3000 f (MHz)
-15 -50
-40
-30
-20
-10 0 Pi (dBm)
Pi = -45 dBm; Tamb = 25 C. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V
Tamb = 25 C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V
Fig 14. Input return loss as a function of frequency; typical values
Fig 15. Input return loss as a function of input power; typical values
0 RLout (dB) -4
(1) (2) (3)
001aak702
0 RLout (dB) -4
001aak703
-8
-8
-12
-12
(4)
-16
-16
(3) (2) (1)
-20 500
1000
1500
2000
2500 3000 f (MHz)
-20 500
1000
1500
2000
2500 3000 f (MHz)
VCC = 1.8 V; Pi = -45 dBm. (1) Tamb = -40 C (2) Tamb = +25 C (3) Tamb = +85 C
VCC = 1.8 V; Tamb = 25 C. (1) Pi = -45 dBm (2) Pi = -30 dBm (3) Pi = -20 dBm (4) Pi = -15 dBm
Fig 16. Output return loss as a function of frequency; typical values
Fig 17. Output return loss as a function of frequency; typical values
BGU7005_2
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 4 March 2010
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NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
0 RLout (dB) -4
001aak704
0 RLout (dB) -4
001aak705
-8
-8
-12
-12
(1) (2) (3)
-16
(1) (2) (3)
-16
-20 500
1000
1500
2000
2500 3000 f (MHz)
-20 -50
-40
-30
-20
-10 0 Pi (dBm)
Pi = -45 dBm; Tamb = 25 C. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V
Tamb = 25 C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V
Fig 18. Output return loss as a function of frequency; typical values
Fig 19. Output return loss as a function of input power; typical values
0 ISL (dB) -10
(1) (2) (3)
001aak706
0 ISL (dB) -10
(4) (3) (2) (1)
001aak707
-20
-20
-30
-30
-40 500
1000
1500
2000
2500 3000 f (MHz)
-40 500
1000
1500
2000
2500 3000 f (MHz)
VCC = 1.8 V; Pi = -45 dBm. (1) Tamb = -40 C (2) Tamb = +25 C (3) Tamb = +85 C
VCC = 1.8 V; Tamb = 25 C. (1) Pi = -45 dBm (2) Pi = -30 dBm (3) Pi = -20 dBm (4) Pi = -15 dBm
Fig 20. Isolation as a function of frequency; typical values
Fig 21. Isolation as a function of frequency; typical values
BGU7005_2
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 4 March 2010
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NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
0 ISL (dB) -10
(1) (2) (3)
001aak708
0 ISL (dB) -10
(1) (2) (3)
001aak709
-20
-20
-30
-30
-40 500
1000
1500
2000
2500 3000 f (MHz)
-40 -50
-40
-30
-20
-10 0 Pi (dBm)
Pi = -45 dBm; Tamb = 25 C. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V
Tamb = 25 C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V
Fig 22. Isolation as a function of frequency; typical values
Fig 23. Isolation as a function of input power; typical values
0 Pi(1dB) (dBm) -4
001aak710
0 Pi(1dB) (dBm) -4
001aak711
(3) (2) (1)
-8
(3) (2) (1)
-8
-12
-12
-16
-16
-20 1.2
1.6
2.0
2.4
2.8 3.2 VCC (V)
-20 1.2
1.6
2.0
2.4
2.8 3.2 VCC (V)
f = 850 MHz. (1) Tamb = -40 C (2) Tamb = +25 C (3) Tamb = +85 C
f = 1850 MHz. (1) Tamb = -40 C (2) Tamb = +25 C (3) Tamb = +85 C
Fig 24. Input power at 1 dB gain compression as a function of supply voltage; typical values
Fig 25. Input power at 1 dB gain compression as a function of supply voltage; typical values
BGU7005_2
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 4 March 2010
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NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
0 Pi(1dB) (dBm) -4
001aak716
-8
(3) (2) (1)
-12
-16
-20 1.2
1.6
2.0
2.4
2.8 3.2 VCC (V)
f = 1575 MHz. (1) Tamb = -40 C (2) Tamb = +25 C (3) Tamb = +85 C
Fig 26. Input power at 1 dB gain compression as a function of supply voltage; typical values
20 IMD3, PL (dBm) 0 -20 -40 -60 -80
001aak717
PL of 1713 MHz signal
20 IMD3, PL (dBm) 0 -20 -40
001aak718 (1) (2) (3)
PL of 1713 MHz signal
(1) (2) (3)
IMD3 of 1575 MHz signal IMD3 of 1575 MHz signal -60 -80
(1) (2) (3) (1) (2) (3)
-100 -120 -40
-100 -120 -40
-35
-30
-25
-20 -15 Pi (dBm)
-35
-30
-25
-20 -15 Pi (dBm)
f = 1575 MHz; f1 = 1713 MHz; f2 = 1851 MHz; Tamb = 25 C. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V
f = 1575 MHz; f1 = 1713 MHz; f2 = 1851 MHz; VCC = 1.8 V. (1) Tamb = -40 C (2) Tamb = +25 C (3) Tamb = +85 C
Fig 27. Third order intermodulation distortion and output power as function of input power; typical values
Fig 28. Third order intermodulation distortion and output power as function of input power; typical values
BGU7005_2
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
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BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
102
(3)
001aak719
102 K
(3) (2) (1)
001aak720
K
(2) (1)
10
10
1
1
10-1 0 2000 4000 6000 8000 10000 f (MHz)
10-1 0 2000 4000 6000 8000 10000 f (MHz)
Tamb = 25 C; Pi = -45 dBm. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V
VCC = 1.8 V; Pi = -45 dBm. (1) Tamb = -40 C (2) Tamb = +25 C (3) Tamb = +85 C
Fig 29. Rollett stability factor as a function of frequency; typical values
Fig 30. Rollett stability factor as a function of frequency; typical values
8.2 GPS front-end
The GPS LNA is typically used in a GPS front-end. A GPS front-end application circuit and its characteristics is provided here.
Ven Vcc
C1
RFin
BPF1 L1
5 3
IC1
4 1
BPF2
6
RFout
2
001aak721
For a list of components see Table 10.
Fig 31. Schematics GPS front-end evaluation board
BGU7005_2
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 4 March 2010
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NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
Table 10. List of components For schematics see Figure 31. Component BPF1, BPF2 Description GPS SAW filter Value Supplier Murata SAFEA1G57KE0F00 Remarks Alternatives from Epcos:
* * * * *
C1 IC1 L1 decoupling capacitor BGU7005 high quality matching inductor 1 nF Various NXP
B9444 SAFEA1G57KH0F00 SAFEA1G57KB0F00 FAR-F6KA-1G5754-L4AA FAR-F6KA-1G5754-L4AJ
Alternatives from Murata:
Alternatives from Fujitsu:
5.6 nH Murata LQW15A
8.3 Characteristics GPS front-end
Table 11. Characteristics GPS front-end f = 1575 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; power at LNA input Pi < -40 dBm; Tamb = 25 C; input and output matched to 50 ; unless otherwise specified. Symbol Parameter VCC ICC Tamb Gp RLin RLout NF Pi(1dB) supply voltage supply current ambient temperature power gain input return loss output return loss noise figure input power at 1 dB gain compression power at LNA input Pi < -40 dBm power at LNA input Pi = -20 dBm power at LNA input Pi < -40 dBm power at LNA input Pi = -20 dBm power at LNA input Pi < -40 dBm power at LNA input Pi = -20 dBm power at LNA input Pi < -40 dBm power at LNA input Pi = -20 dBm f = 1575 MHz f = 806 MHz to 928 MHz f = 1612 MHz to 1909 MHz IP3i ton toff
[1] [2] [3] [4] [5]
[2] [2] [3] [1] [1] [1] [1] [1] [1] [1] [1]
Conditions RF input AC coupled
Min Typ 1.5 4.5
Max 2.85 +85
Unit V mA C dB dB dB dB dB dB dB dB dBm dBm dBm dBm
-40 +25
14.5 15.5 8.5 10.5 14.5 12.5 1.8 1.9 -8.2 31 40 64 -
input third-order intercept point attenuation turn-on time turn-off time
Power at GPS front-end input = power at LNA input + attenuation BPF1. Out of band. f1 = 1713 MHz; f2 = 1851 MHz. Relative to f = 1575 MHz. Within 10 % of the final gain.
All information provided in this document is subject to legal disclaimers.
f = 850 MHz f = 1850 MHz
[4] [4] [5] [5]
95 90 -
-
2 1
dBc dBc s s
BGU7005_2
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Product data sheet
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NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
9. Package outline
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886
b 1 2 3 4x L1 L
(2)
e
6 e1
5 e1
4
6x
(2)
A
A1 D
E
terminal 1 index area 0 DIMENSIONS (mm are the original dimensions) UNIT mm A (1) max 0.5 A1 max 0.04 b 0.25 0.17 D 1.5 1.4 E 1.05 0.95 e 0.6 e1 0.5 L 0.35 0.27 L1 0.40 0.32 1 scale 2 mm
Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 REFERENCES IEC JEDEC MO-252 JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22
Fig 32. Package outline SOT886 (XSON6)
BGU7005_2 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved.
Product data sheet
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15 of 19
NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
10. Abbreviations
Table 12. Acronym AC FM GPS HBM LNA MMIC PDA RF SAW SiGe:C Abbreviations Description Alternating Current Frequency Modulation Global Positioning System Human Body Model Low Noise Amplifier Monolithic Microwave Integrated Circuit Personal Digital Assistant Radio Frequency Surface Acoustic Wave Silicon Germanium Carbon
11. Revision history
Table 13. Revision history Release date 20100304 Data sheet status Product data sheet Change notice Supersedes BGU7005_1 Document ID BGU7005_2 Modifications: BGU7005_1
* *
The status of this document has been changed into "Product data sheet". Table 7 on page 3: The values for ISL have been changed. Preliminary data sheet -
20091028
BGU7005_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 4 March 2010
16 of 19
NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
12. Legal information
12.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer's third party customer(s) (hereinafter both referred to as "Application"). It is customer's sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the
(c) NXP B.V. 2010. All rights reserved.
12.3 Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
BGU7005_2
All information provided in this document is subject to legal disclaimers.
Product data sheet
Rev. 02 -- 4 March 2010
17 of 19
NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
BGU7005_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 4 March 2010
18 of 19
NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
14. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 8.2 8.3 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 5 GPS LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 GPS front-end. . . . . . . . . . . . . . . . . . . . . . . . . 13 Characteristics GPS front-end . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Contact information. . . . . . . . . . . . . . . . . . . . . 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 4 March 2010 Document identifier: BGU7005_2


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